Electronics Package Design Engineer
Created at: November 10, 2025 00:57
Company: MetaOption, LLC
Location: New York, NY, 10001
Job Description:
Electronics Package Design Engineer Primary Skills - package layout, signal integrity, flip chip, bga, ceramic, multi-chip modules, electronics packaging, system in package, cadence Job Description Electronics Packaging Design Engineer We are seeking an experienced Electronics Packaging Design Engineer to join our team. In this role, you will lead the design of advanced packaging solutions including flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architec…